? semiconductor components industries, llc, 2006 february, 2006 ? rev. 5 1 publication order number: murb1620ct/d murb1620ct preferred device switchmode power rectifier d 2 pak power surface mount package these state?of?the?art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. features ? package designed for power surface mount applications ? ultrafast 35 nanosecond recovery times ? 175 c operating junction temperature ? epoxy meets ul 94 v?0 @ 0.125 in ? high temperature glass passivated junction ? low leakage specified @ 150 c case temperature ? short heat sink tab manufactured ? not sheared! ? similar in size to industrial standard t o?220 package ? pb?free packages are available mechanical characteristics: ? case: epoxy, molded, epoxy meets ul 94, v?0 ? weight: 1.7grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? device meets msl1 requirements ? esd ratings: machine model, c (>400 v) human body model, 3b (>8000 v) maximum ratings (per leg) rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 200 v average rectified forward current (rated v r , t c = 150 c) total device i f(av) 8.0 16 a peak repetitive forward current (rated v r , square wave, 20 khz, t c = 150 c) i fm 16 a non?repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 100 a operating junction and storage temperature range t j , t stg ?65 to +175 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. device package shipping ? ordering information murb1620ct d 2 pak 50 units/rail ultrafast rectifier 16 amperes, 200 volts 1 3 4 preferred devices are recommended choices for future use and best overall value. murb1620ctt4 d 2 pak 800/tape & ree l http://onsemi.com d 2 pak case 418b style 3 3 4 1 marking diagram ay ww u1620g aka a = assembly location y = year ww = work week u1620 = device code g = pb?free package aka = diode polarity murb1620ctt4g d 2 pak (pb?free) 800/tape & ree l MURB1620CTG d 2 pak (pb?free) 50 units/rail ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d.
murb1620ct http://onsemi.com 2 thermal characteristics (per leg) rating symbol value unit maximum thermal resistance, junction?to?case r jc 3 c/w maximum thermal resistance, junction?to?ambient r ja 50 c/w temperature for soldering purposes: 1/8 from case for 5 seconds t l 260 c electrical characteristics (per leg) characteristic symbol max unit maximum instantaneous forward voltage (note 1) (i f = 8 a, t c = 150 c) (i f = 8 a, t c = 25 c) v f 0.895 0.975 v maximum instantaneous reverse current (note 1) (rated dc voltage, t c = 150 c) (rated dc voltage, t c = 25 c) i r 250 5 a maximum reverse recovery time (i f = 1 a, di/dt = 50 a/ s) (i f = 0.5 a, i r = 1 a, i rec = 0.25 a) t rr 35 25 ns 1. pulse test: pulse width = 300 s, duty cycle 2.0% p f(av) , average power dissipation (watts) 10 8.0 6.0 4.0 2.0 10 0 9 8 7 6 5 4 3 2 1 0 t c , case temperature ( c) i f(av) , average power dissipation (watts) 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 180 170 160 150 140 v r , reverse voltage (v) i r , reverse current (a) 0.01 0.04 0.2 1 4 20 100 400 1.0 k 200 160 120 80 40 0 100 50 20 , instantaneous forward current (amps) i f 10 5.0 2.0 0.1 0.2 0.4 0.6 0.8 1 1.2 v f , instantaneous voltage (v) figure 1. typical forward voltage, per leg 0.7 0.3 100 c 25 c t j = 175 c 20 60 100 140 180 100 c 25 c t j = 175 c rated v r applied r jc = 3 c/w dc square wave i f(av) , average forward current (amps) 9.0 7.0 5.0 3.0 1.0 t j = 175 c dc square wave 0 10 k 1.0 figure 2. typical reverse current, per leg* figure 3. current derating case, per leg figure 4. power dissipation, per leg
murb1620ct http://onsemi.com 3 figure 5. thermal response r(t), transient thermal resistance (normalized) 0.01 0.02 0.05 0.1 0.2 0.5 1 1k 100 200 500 10 20 50 12 5 0.1 0.2 0.5 0.01 0.02 0.05 t, time (ms) p (pk) t 1 t 2 z jc(t) = r(t) r jc d curves apply for power pulse train shown read time at t 1 duty cycle, d = t 1 /t 2 t j(pk) ? t c = p (pk) z jc(t) d = 0.5 0.1 0.05 0.01 single pulse figure 6. typical capacitance, per leg v r , reverse voltage (v) c, capacitance (pf) 10 1 10 100 30 100 300 1 k t j = 25 c
murb1620ct http://onsemi.com 4 package dimensions style 3: pin 1. anode 2. cathode 3. anode 4. cathode seating plane s g d ?t? m 0.13 (0.005) t 23 1 4 3 pl k j h v e c a dim min max min max millimeters inches a 0.340 0.380 8.64 9.65 b 0.380 0.405 9.65 10.29 c 0.160 0.190 4.06 4.83 d 0.020 0.035 0.51 0.89 e 0.045 0.055 1.14 1.40 g 0.100 bsc 2.54 bsc h 0.080 0.110 2.03 2.79 j 0.018 0.025 0.46 0.64 k 0.090 0.110 2.29 2.79 s 0.575 0.625 14.60 15.88 v 0.045 0.055 1.14 1.40 ?b? m b w w notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 418b?01 thru 418b?03 obsolete, new standard 418b?04. f 0.310 0.350 7.87 8.89 l 0.052 0.072 1.32 1.83 m 0.280 0.320 7.11 8.13 n 0.197 ref 5.00 ref p 0.079 ref 2.00 ref r 0.039 ref 0.99 ref m l f m l f m l f variable configuration zone r n p u view w?w view w?w view w?w 123 d 2 pak 3 case 418b?04 issue j *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 8.38 0.33 1.016 0.04 17.02 0.67 10.66 0.42 3.05 0.12 5.08 0.20 mm inches scale 3:1z
murb1620ct http://onsemi.com 5 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, r epresentation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 murb1620ct/d switchmode is a trademark of semiconductor components industries, llc. literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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